Aluminum nitride substrates, aluminum nitride wafers. Toward miniaturization of high power microelectronic circuits and other high thermal hazard-free applications. A variety of specification requirements.

Dicing hybrid, semiconductor and dicing MEMS wafers. Dicing Services for Hybrids and Semiconductors. Backgrinding and slicing services are provided by for both dicing process development. As well as high volume contract dicing requirements. Dicing saws are fully programmable and equipped with high power microscopes for precision alignment. And Quartz disks, Silicon Carbide, Ferrites. And rough cutting of plates as large as 18 x 18. Valley also provides backlapping and thinning. For a complete summary of .

Edge polishing, angle polishing and facet optical polishing. Edge, Angle-Facet Optical Polishing for Optoelectronics. Edge polishing, waveguide angle-facet polishing, end polishing, optical polishing, fiber optic polishing. Dicing, flat lapping and machining of all hard materials including Ceramic substrates, Quartz, AlN, Glass and Sapphire windows, Silicon wafers and very thin substrates and windows. One of the major challenges of optical edge polishing involves compensating for the height differential .

Infrared Germanium Optical Wafer, Window and Germanium Crystals. Germanium Ge infrared optical windows and wafers. We strive to have excellent service regarding flatness, parallelism, tolerances, and surface finish for all our products. Germanium Wafers, Blanks, Disks and Windows.

Optical Polishing Services for all Materials. Polished Fused Silica wafers, substrates, and windows. Polished ultra-thin wafers and substrates from all materials. Indars Interferometer for thin transparent wafer flatness measurement. CMP polishing of oxide coatings. Angle and edge optical polishing.